BlockBeats News, June 22: Intel CEO Pat Gelsinger recently stated in a "No Priors" podcast interview that his return target for Intel is to achieve a "10x within 5 to 10 years." He mentioned that Intel is restructuring its technology roadmap around advanced packaging, new semiconductor materials, and next-generation substrate technologies.

Gelsinger stated that Intel is focusing on advanced packaging technologies such as EMIB and Foveros, as well as new materials such as gallium nitride, silicon carbide, indium phosphide, and lab-grown diamonds to address the challenges of approaching the physical limits of traditional process nodes. He also mentioned that the surge in AI and inference workloads is driving a CPU demand recovery, and the true potential of Intel's foundry business may gradually emerge after 2030.