TrendForce: TSMC Accelerates CoWoS Development, Glass-Based Interposers to Achieve Mass Production Post-2030

BASED0%

BlockBeats News, June 17th, TrendForce's latest report indicates that the rapid growth in demand for AI semiconductors is driving the advancement of advanced packaging technologies, with Fan-Out Panel-Level Packaging (FOPLP) emerging as the new industry battleground. TSMC is currently focusing on the CoWoS packaging architecture and has standardized the use of a 310 × 310 mm panel format.

It is expected that 2026 will be a critical validation period for relevant equipment and material suppliers, with a target for pilot production in 2027 and mass production in the second half of 2028. In addition to CoWoS, TSMC's next-phase focus is expected to shift to glass core substrates, with commercial-scale production likely to occur after 2030.

Sumber: BlockBeats

Disclaimer: Konten ini berasal dari pihak lain atau diterjemahkan oleh AI dari pihak lain. CoinEx tidak menjamin konten ini benar, asli, atau akurat, dan tidak memberikan saran investasi. Harga aset kripto sangat tidak stabil, jadi harap berhati-hati terhadap risiko yang ada.

Kabar TerkaitSelengkapnya

A certain whale with an $80 million position engaged in high-leverage longing of BTC and ETH, accumulating a historical profit of over $4 million.

Castle Securities Forecasts Fed to Hike Rates by 75 Basis Points This Year, Earliest Tightening Cycle Could Start in September

Reuters: U.S. Military Secretly Transported Gulf Oil Following Iran's Model

Pencarian Teratas

Kripto
Harga
Perubahan 24J